Cover Image

Materials for high-density electronic packaging and interconnection.

Corporate Author: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
Format: Book
Language:English
Published: Washington, D.C. : National Academy Press, 1990.
Subjects:
Electronic packaging > Materials.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Online Access:http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=14491
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050 4 |a TK7870  |b .N35 1990eb 
110 2 |a National Research Council (U.S.).  |b Committee on Materials for High-Density Electronic Packaging. 
245 1 0 |a Materials for high-density electronic packaging and interconnection. 
260 |a Washington, D.C. :  |b National Academy Press,  |c 1990. 
300 |a 1 online resource (xiv, 139 pages) :  |b illustrations 
500 |a Available from Defense Technical Information Center, Cameron Station. 
504 |a Includes bibliographical references. 
650 0 |a Electronic packaging  |x Materials. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Microelectronics. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Electronics  |x Digital. 
650 7 |a Electronic packaging  |x Materials. 
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