Materials for high-density electronic packaging and interconnection.
| Corporate Author: | |
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| Format: | Book |
| Language: | English |
| Published: |
Washington, D.C. :
National Academy Press,
1990.
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| Subjects: | |
| Online Access: | http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=14491 |
| Item Description: | Available from Defense Technical Information Center, Cameron Station. |
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| Physical Description: | 1 online resource (xiv, 139 pages) : illustrations |
| Bibliography: | Includes bibliographical references. |
| ISBN: | 0585143951 9780585143958 030904233X 9780309042338 |