Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing /
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| Format: | Book |
| Language: | English |
| Published: |
Hoboken, N.J. :
Wiley,
2011.
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| Online Access: | http://site.ebrary.com/lib/ucy/Doc?id=10494525 |
Table of Contents:
- pt. 1. Mechanics and modeling
- pt. 2. Modeling in microelectronic packaging and assembly
- pt. 3. Modeling in microelectronic package reliability and test
- pt. 4. Modern modeling and simulation methodologies : application to nano packaging.