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Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.

Corporate Authors: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging., ebrary, Inc.
Format: Book
Language:English
Published: Washington, D.C. : Alexandria, VA : National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
Subjects:
Electronic packaging > Materials.
Electrical engineering > Materials.
Online Access:http://site.ebrary.com/lib/ucy/Doc?id=10060398
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110 2 |a National Research Council (U.S.).  |b Committee on Materials for High-Density Electronic Packaging. 
245 1 0 |a Materials for high-density electronic packaging and interconnection  |b report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. 
260 |a Washington, D.C. :  |b National Academy Press ;  |c 1990.  |a Alexandria, VA :  |b Available from Defense Technical Information Center, Cameron Station, 
300 |a xiv, 139 p. :  |b ill. 
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