(1990). Materials for high-density electronic packaging and interconnection: Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Washington, D.C. : Alexandria, VA: National Academy Press ; Available from Defense Technical Information Center, Cameron Station.
Chicago Style CitationMaterials for High-density Electronic Packaging and Interconnection: Report of the Committee On Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission On Engineering and Technical Systems, National Research Council. Washington, D.C. : Alexandria, VA: National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.
MLA CitationMaterials for High-density Electronic Packaging and Interconnection: Report of the Committee On Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission On Engineering and Technical Systems, National Research Council. Washington, D.C. : Alexandria, VA: National Academy Press ; Available from Defense Technical Information Center, Cameron Station, 1990.