Double sided board fabrication (pattern plate, TIN-Lead Reflow)

Main Author: Pritchard, Mark
Corporate Author: Institute for Interconnecting and Packaging Electronic Circuits
Format: Visual Material
Language:English
Published: Northbrook, IL. : IPC Science and Technology Press, 1997.
Subjects:
ΒιβλιοθήκηΤαξιθετικός αριθμόςΑριθμός ΑντιτύπωνΠληροφορίεςΚατάσταση
ΤΕΙ ΚρήτηςTS250 .P58 19922ΠροβολήOPAC