IEEE Transactions on Components and Packaging Technologies
Format: | Book |
---|---|
Published: |
New York:
Institute of Electrical and Electronics Engineers, Inc.,
1978
|
Subjects: | |
Online Access: | http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=95 http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144 |
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