11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /

Corporate Author: International Congress Molded Interconnect Devices Nuremberg / Fuerth, Germany)
Other Authors: Franke, Jörg,
Format: Book
Language:English
Series:Advanced Materials Research, Volume 1038
Subjects:
Online Access:http://site.ebrary.com/lib/ucy/Doc?id=10951273

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http://site.ebrary.com/lib/ucy/Doc?id=10951273
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