Description: Lead-free solder interconnect reliability

Corporate Author:	ebrary, Inc.
Other Authors:	Shangguan, Dongkai,
Format:	Book
Language:	English
Published:	Materials Park, OH : ASM International, 2005.
Subjects:	Microelectronic packaging > Reliability. Solder and soldering.
Online Access:	http://site.ebrary.com/lib/ucy/Doc?id=10320384

Physical Description:	x, 292 p. : ill.
Bibliography:	Includes bibliographical references and index.